Commonly used materials for PTFE Board are copper, aluminum, low carbon steel, stainless steel, chromium-nickel alloy steel, titanium monel alloy and so on. In order to reduce the bolt load and ensure a compact structure, in addition to the narrow width of the metal flat pads, the damping performance of various ring pad damping rubber plates with line contact characteristics mainly depends on the molecular structure of the rubber, such as the attractive on the molecular chain When the volume of the side group is large, the movement of the chain segment is hindered, the internal friction between the molecules is increased, and the damping coefficient tan & is increased.
The presence of crystals will also reduce the damping characteristics of the system. For example, when a crystal IR is mixed in a CIIR with good damping effect, the damping coefficient tan & of the rubber will decrease as the IR content increases. In general rubber, the order of tan & from large to small is: Although tan & of I is relatively small, its comprehensive properties such as fatigue resistance, heat generation, creep and metal adhesion are good, so NR is also widely used for vibration reduction rubber Board. If low temperature resistance is required, it can be used in combination with BR; when weather resistance is required, CR can be used; when oil resistance is required, NBR can be used; for low temperature dynamic performance, silicone rubber can be used. NR is generally used when low damping is required.
Various characteristics of the polytetrafluoroethylene sheet indicate that when the temperature is less than 19 ° C, a 13/6 spiral form is generated; when the temperature is changed at 19 ° C, the molecular structure is slightly released, resulting in a 15/7 spiral form. Although the carbon-carbon bond and carbon-fluorine bond rupture must be digested and absorbed in the perfluorocarbon spraying chemical respectively, the kinetic energy is 346.94 and the polytetrafluoroethylene plate is depolymerized and converted into 1 mol of tetrafluoroethylene with only 171.38kJ. Therefore, during high-temperature cracking, the key depolymerization of the polytetrafluoroethylene board is tetrafluoroethylene. The weight loss rate (%) of polytetrafluoroethylene at 260, 370 and 420 ° C is each hour. PTFE can be used for a long time at 260 ° C. Because the toxic combustion products fluorophosgene and perfluoroisobutylene are also caused during high temperature cracking, it is necessary to pay attention to safety precautions and avoid touching PTFE with fire.
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